Digital Controlled Infusion Syringe Pump

Digital Controlled Infusion Syringe Pump

Lab single channel syringe pump is a single-channel perfusion/extraction syringe pump, which is mainly used in biological laboratories, with integrated structure. It can hold different sizes of syringes (sample injectors), and the micro syringe pump is suitable for high precision, low flow liquid transport

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Contact us :

If you are interested in our Digital Controlled Infusion Syringe Pump, please contact us for more information and quotation.

Tel: 86 159 3625 3205

Email: zerlinda@zztainuo.com

Contact person: Zerlinda

WeChat: 86 159 3625 3205

Technical Specifications:

Micro syringe pump working mode	Perfusion, extraction
Number of syringes	1
Maximum stroke	140mm
Stroke resolution	0.156μm
Line speed range	5μm/min-65mm/min (flow rate = line speed × syringe area)
Line speed adjustment resolution	5μm/min
Stroke control accuracy	Error ≤ ± 0.5% (stroke ≥ 30% of the maximum stroke)
Rated linear thrust	>90N
Syringe selection	Built-in main manufacturers, the main model of the syringe for selection
Syringe definition	May directly enter the inner diameter of the syringe
Flow correction	Get a more accurate volume through the calibration procedure
Operating parameter settings	Dispensing liquid volume, injection time, etc.
Display parameter selection	Fluid volume, flow rate, or linear velocity
Power-down memory	After power-on, you can choose whether to continue working according to the state before power off.
Status signal output	2-channel OC gate signal output for indicating start/stop and direction status
Control signal input	2 channel start/stop control input end, 1 channel falling edge trigger signal control start and stop; 1 channel TTL level signal control start and stop
Communication Interface	RS485
Dimensions	280×210×140 (mm)
weight	3.69kg
Power supply	AC 90V-260V/15W
Working environment relative humidity	<80%
Working environment temperature	0℃- 40℃

Main accessories：

Project name	Quantity
host	1 pcs
syringe	1 pcs
Power cord	1 pcs
Operation Manual	1 pcs

Application

Pharmaceutical manufacturing;

Chemical experiments;

Food and beverage industry;

Water treatment;

Fuel injection; Semiconductor and electronic component manufacturing;

Laboratory applications

Application Cases《Spin coater uses injection pump to coat photoresist》

The process of coating photoresist using an injection pump in a spin coater usually includes the following steps to ensure that the photoresist is evenly covered on the substrate to form a film of the required thickness:

1. Preparation

Ensure that the spin coater and injection pump are clean, and check whether the correct photoresist solution has been loaded into the injection pump.

Set the speed and spin coating time of the spin coater according to the characteristics of the photoresist and the requirements of the substrate.

2. Substrate pretreatment

Clean the substrate (such as a silicon wafer) to ensure that the surface is free of oil and impurities. Plasma cleaning or baking pretreatment can be performed if necessary.

Fix the substrate on the turntable of the spin coater to ensure that the center of the substrate is aligned so that the coating is uniform.

3. Injection pump parameter setting

Set the flow rate and injection speed of the injection pump, and adjust the injection amount according to the required film thickness and the characteristics of the photoresist.

Generally, the coating thickness of the photoresist is related to the injection amount and the spin coating speed. The specific parameters usually need to be optimized according to the laboratory process.

4. Injection and spin coating process

Start the spin coater and set the initial low speed (e.g. 500 RPM) for pre-spin coating.

Start the injection pump to evenly inject the photoresist solution into the central area of the substrate. The injection pump accurately injects a certain amount of photoresist by controlling the liquid volume.

When the photoresist completely covers the surface of the substrate, the spin coater will accelerate to the set final speed (e.g. 3000 RPM) for high-speed rotation to shake off excess photoresist and form a uniform film.

5. Baking after spin coating

After the spin coating is completed, the substrate is removed from the spin coater and placed on a hot plate or oven for baking (usually 90°C to 120°C for 1 to 2 minutes) to remove the solvent and solidify the film.

This baking process helps to improve the adhesion and stability of the photoresist.

6. Thickness detection and quality inspection

Use a film thickness measuring instrument to detect the thickness of the photoresist layer to ensure that it meets the process requirements.

If the thickness or uniformity does not meet the requirements, it may be necessary to adjust the spin coating speed, injection volume and other parameters and then re-coat.

7. Subsequent process preparation

After the photoresist is coated and baked, the substrate can be used for subsequent photolithography, exposure and development steps.

Key points:

1. Injection volume: The injection volume of the photoresist directly affects the thickness of the coating. Precise control of the injection pump helps to achieve consistent film thickness.

2. Spin coating speed: The acceleration and final rotation speed of the spin coating process determine the distribution uniformity and film thickness of the photoresist.

3. Bake time and temperature: The correct baking conditions can remove solvents, avoid bubbles and shrinkage problems on the film surface, and improve the chemical resistance and stability of the photoresist.

Through the combination of the injection pump and the spin coater, the photoresist coating process can be effectively controlled to achieve uniform and stable film coating, laying a good foundation for subsequent photolithography steps.