Lab 13.56MHz RF Vacuum plasma cleaner

The radio frequency plasma cleaner is a device that uses a radio frequency power supply to generate plasma to clean the surface of objects. It applies radio frequency energy in a vacuum chamber to ionize the process gas and form plasma. The active particles in the plasma react physically and chemically with the contaminants on the surface of the object to be cleaned, thereby achieving the purpose of removing contaminants and cleaning the surface.

Product Overview:

Working principle: In a vacuum environment, the radio frequency generator generates a high-frequency electric field, which ionizes the process gas (such as oxygen, argon, hydrogen, etc.) into plasma. The plasma contains ions, electrons, active groups, etc., which remove dirt, organic matter, oxide layers and other contaminants on the surface of the object through physical bombardment and chemical reactions.
Main components: It usually consists of a control system, an excitation power supply system, a vacuum chamber, a process gas system, and a vacuum pump system. Among them, the control system is used to set and adjust the cleaning parameters; the excitation power supply system provides radio frequency energy; the vacuum chamber is the space where plasma is generated and cleaning is carried out; the process gas system is responsible for transporting and controlling the flow rate of the process gas; the vacuum pump system is used to maintain the vacuum environment.

Product Features:

Here are some key features of a plasma cleaner:

Non-Contact Processing: Plasma cleaning is a non-contact method, which means it does not physically wear or damage the substrate being cleaned.

High Precision: Capable of achieving very precise cleaning at the micro and nanoscale levels.

Versatility: Can clean a wide range of materials, including metals, semiconductors, glass, and plastics.

Efficiency: Plasma cleaning is a fast process that can significantly reduce production times.

Controlled Environment: The process can be conducted in a controlled environment, which is essential for sensitive applications.

Residual Gas Activation: The ability to activate residual gases to create a reactive plasma that effectively cleans surfaces.

Customizable Process Parameters: Allows for the adjustment of parameters such as gas flow rate, pressure, temperature, and treatment time to achieve desired results.

Improved Surface Properties: Enhances surface properties like wettability, adhesion, and biocompatibility. 

Cost-Effective: Reduces the need for chemicals and solvents, making it a more cost-effective cleaning solution.

Environmentally Friendly: Plasma cleaning is a "green" technology that minimizes the use of harmful chemicals and reduces waste.

Purchase Information:

If you are interested in our Lab laser etching machine, please contact us for more information and a quote.

Phone: 183-3926-3857
Email: jack@cysitech.com
Contact Person: Jack Yang
WeChat: 183 3926 3857

Product details: 

Major Parts：

Application Areas：

The plasma cleaning machine is widely applied across various industries due to its ability to remove contaminants and modify surface properties effectively. Here are some key application areas:

Semiconductor Industry: Plasma cleaning is crucial for removing organic and inorganic contaminants from semiconductor wafers, ensuring a clean and defect-free surface, which is vital for the reliability and functionality of semiconductor devices .

Medical Devices: Plasma treatment is used for sterilization in medical devices and equipment, providing a rapid and effective method for disinfection without the use of chemicals or high temperatures .

Aerospace: Plasma cleaning is used for surface treatment of aerospace components, preparing surfaces for bonding, coating, and assembly, which contributes to the durability and longevity of aircraft and spacecraft .

Electronics Manufacturing: Plasma cleaning ensures high cleanliness required for processes like wire bonding, soldering, and the application of conformal coatings, enhancing the performance and longevity of electronic devices .

Automotive Industry: Plasma cleaning is used for surface preparation in the manufacturing of automotive components, including engine control units and advanced driver guidance systems .

Scientific Research: Plasma cleaners are used in high-energy physics experiments and space exploration for particle detection and sensor functionality .

Optics: Plasma cleaning is essential for ensuring the clarity and performance of lenses used in various applications, from cameras to microscopes and optical instruments .

Metal Treatment: Plasma cleaning of metals such as silver and copper enhances surface properties like conductivity and reflectivity, and ensures surface hygiene .

These applications highlight the versatility and importance of plasma cleaning technology in achieving high standards of cleanliness and surface modification across different sectors.

Application Case:  " Plasma Cleaner for Wafer Cleaning"

The process of cleaning wafer samples with radio frequency plasma cleaner technology is relatively complex and requires precise control of various parameters. The following is a general process guidance:

Required Equipment and Materials:

Plasma cleaner equipment
Wafer samples
Vacuum pump system
Gas supply system (usually argon, nitrogen)
PLC control device

Steps:

Equipment Preparation:

Ensure that all parts of the plasma cleaner are intact and check whether the connection lines of the equipment are normal.
Check and ensure that the power supply of the equipment is stable and connected.
Check and ensure that the working area is clean and tidy, without flammable items.

Gas Preparation:

Check that the nitrogen and oxygen cylinders connected to the plasma cleaner are connected properly and have sufficient gas. Unscrew the main valve of the nitrogen source, adjust the pressure of the pressure reducing valve to about 0.4 bar, and turn on the gas source switch.

Sample Placement:

Place the wafer sample to be cleaned on the shelf of the cleaner. If the sample size is too small, it can be placed in a tray first and then on the shelf. Close the chamber door.

Parameter Setting:

Press the "ENTER" key on the control panel to enter the adjustment, and select the required air inlet, power and time.

Start Cleaning:

After selection, press "Start" to begin. In the near-vacuum chamber, the radio frequency power supply makes the gas glow under high voltage, generating high-energy plasma to bombard the wafer surface and achieve the cleaning effect.

End of Cleaning:

After the cleaning is completed, wait until the external gas fills the chamber before opening the chamber door. If the gas has not filled the chamber, do not force the door open.

Sample Removal: 

Open the chamber and take out the cleaned wafer sample; place the sample again for cleaning. In order to ensure that each sample is thoroughly cleaned, the number of samples placed at one time should not be too large.

Equipment Shutdown:

After all samples have been cleaned, turn off all gas source switches and main valves, and close the door of the plasma cleaner.

Maintenance:

Perform regular maintenance and repair and maintenance. When performing maintenance and repair and maintenance on the plasma cleaner, turn off the power supply of the machinery and equipment first, and do not operate with electricity to prevent accidents.

The above steps outline the basic process of using a plasma cleaner to clean wafer samples, ensuring the cleanliness of the wafer surface and laying a good foundation for subsequent semiconductor manufacturing processes.